Company Background:
Our client is a leading MNC chipmaker in the computing and communications industries.

Description:
Global Server Innovation Group is looking for a creative thinker to help drive and define new system enclosures and thermal solutions for the Server business. In this position, you will be responsible for coordinating concept development with cross-discipline groups both internal and Outsourced Design Centers (ODC) to ensure that the resultant products are strategically aligned, technically viable, relevant to the end user, and cost effective.

Qualifications:
You should possess a technical Bachelors degree (a Bachelor of Science degree in Electrical Engineering is preferred) or higher and a minimum of four to six years of direct experience. Additional qualifications include:

• Ability to communicate technically in both Mandarin and English. 
• Ability to demonstrate experience defining and developing new, innovative packaging solutions. 
• Thrive in dynamic and amorphous environments, and be skilled in drawing out new ideas from individual and team interactions. 
• Entrepreneurial spirit, adept at pushing development and qualification from initial concept to finished product. 
• Leadership capabilities and a track record of working with multiple disciplines. 
• Assertive, tactical, and well-versed in product life cycles, knowledgeable of PC architecture and a have a solid understanding of the latest technologies and industry trends. 
• Strong background in EMC, Regulatory testing, environmental testing, thermal management and have a proven ability to debug problems and drive them to resolution. 
• Understanding board design, interconnect methodologies and possessing strong organizational and documentation skills. 
• Ability to demonstrate your ability to deliver your designs on time using the appropriate design analysis to support your work. 
• Comfortable working with suppliers and ODC's to complete required design, validation, qualification, and fabrication of your concepts.