Company Background:
Our client is a leading MNC chipmaker in the computing and communications industries.

Job description
In this position, you will be reporting to Process Engineering Manager and working closely with process engineering and manufacturing equipment teams to start up and ramp the 1st It 300 mm Fab in Asia and will be located in Dalian. Applying to this posting will allow you to be considered for all equipment engineer positions available at this time. It may require training assignment in the US for up to one year before locating to Dalian, China. Your responsibilities will include but not be limited to:

• Transferring process technology into F68, the 1st It 300 mm Fab in Asia.
• Leading and owning equipment qualification, tool preventative maintenance, management of troubleshooting activities, regular monitoring of tool/process performance, and cost reduction to achieve equipment excellence under LEAN principle.
• Working with existing It 300mm fabs around the world to improve tool performance, reduce cost, and increase flexibility in process transfer.
• Working and leading manufacturing equipment teams to develop inventive solutions to improve execution and efficiency in a high-volume manufacturing environment.

Qualifications
You should possess a Bachelor's or a Master's degree in Engineering or Sciences and more than 3 plus years of direct semiconductor industry experience. Additional qualifications include:

• Equipment expert, and hand-on experience required.
• Good understanding of factory and/or fabrication operations.
• A strong understanding of semiconductor equipment impact to process technology, manufacturing science and systems, and engineering applications 
• Critical data and Engineering analysis skills and software proficiency. Ability to summarize complex data sets for technical and non-technical audiences.
• Technical expertise within Semiconductor equipment and be able to provide technical direction on all quality issues. 
• Excellent listening, written and verbal communication, tolerance of ambiguity, and commitment to task. 
• Demonstrated technical leadership capability including strong training, mentoring and coaching skills.
• Demonstrated the capability of working in and leading a high performing team culture which includes: setting high expectations, driving accountability to those expectations, role modeling the desired culture, possess excellent teamwork, demonstrated problem solving and prioritization skills, and driving high performance maintenance goals for the group.
• Ability to work in a culturally diverse environment.
• Fluency in Mandarin and good command of English.

Specific function areas/toolsets:

• Litho scanner, track, process integration and litho metrology.
• Diffusion, implant, RTA, CVD, PVD, Cu plating, CMP, Thin Film Metrology, defect metrology equipment, and wafer handling equipment.
• Wet clean/etch and plasma etch/ash.