Company Background:
Our client is a leading MNC chipmaker in the computing and communications industries.

Description:
In this position, you will be joining a technical marketing team and will be providing customers with world-class support as well as working with internal design teams to define, develop and enable UP, DP and MP server and/or workstation platform components. Your responsibilities will include but not be limited to:

• Working with customers to ensure design feasibility, robustness and readiness for rapid ramps into high volume production. 
• Breaking new ground by predicting, understanding and resolving technical issues associated with platform level thermal management and mechanical integration of microprocessors and chipsets. 
• Developing collaterals (design guides, specifications, training material, and others), producing enabling tools (thermal test tools, statistical analysis, models, and others) and educating the industry and our customers on how to reliably integrate it processors and or chipsets in their products in a time to market (TTM) environment. 
• Communicating it product roadmaps including technical requirements and bringing and/or implementing the customer and/or industry feedback in it's design to assure it product specifications and enabling components are competitive.

Qualifications:

You must possess a Master or a Bachelor of Science degree in Mechanical Engineering with couple of years of experience in computer thermal and/or mechanical engineering (preferably server environment). Additional qualifications include:

• Excellent communication skills with an understanding of how to properly market and deliver technical material. 
• Proficiency in Microsoft* Office* Suite (Word*, Excel*, PowerPoint*, and Outlook*). 
• Good understanding of IA-32 architecture and industry. 
• Experience with thermal and/or mechanical analysis tools (Flotherm*, Icepak*, Pro-E*, and others).