Company Background:
Our client is a leading MNC chipmaker in the computing and communications industries.

Hiring brief comments: to finding a good senior Mechanical Engineer that is experienced in plastic resins, plastic injection molding, and the tools that are used for manufacturing notebook enclosures (design the LCD/key board/¡­etc¡­ of notebook).  prefer Taiwan candidates with rich TW working experience and willing to base in SH.

Qualifications:
You should possess a Bachelor of Science degree in Mechanical Engineering with at least seven years or a Master of Science degree in Mechanical Engineering with at least five years of hand-on experience in the ME design. Additional qualifications include:

• Knowledge of manufacturing processes (plastic injection molding, sheet metal forming, stamping, machining, casting and thixomolding). 
• Minimum of five years of Pro and/or E design software, Flo-Therm*, Ice-Pak* and other related tools. 
• Demonstrated ability to guide the work of junior Mechanical Engineers as well as networking with external design houses and suppliers. 
• Familiarity with environmental and dynamic testing. 
• Experience in mechanical design of medium to high volume electronic systems and enclosures, including design for thermals, acoustics, and EMI 
• Notebook computer and/or CE system design experience would be an added advantage. 
• Knowledge of It Blue Book environmental test procedures would be an added advantage. 
• Knowledge of PC Architecture and familiarity with computer system form factor specifications (for example. ATX, BTX) would be an added advantage. 
• Knowledge of structural and/or thermal analysis would ba an added advantage 
• Good written communications in Chinese and English and good verbal communications in Mandarin and English would be an added advantage. 
• Ability to travel to Taiwan, PRC, Malaysia, and other APAC countries would be an added advantage. 
• Full understanding of NB assembly and production process would be an added advantage.

Responsibilities:
In this position, you will be responsible to research, design, and develop mechanical and electro-mechanical devices and/or systems targeted for the mobile segment. You will also be responsibilities for mechanical design for notebook PC systems, leading the mechanical design team, working with 3rd party design houses/ODM/OEM in APAC, Customer and vendor engagements, troubleshooting ME issues in EVT, DVT, PVT, and project front end feasibility study and innovation concept investigation.